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Authordc.contributor.authorBenito, Noelia 
Authordc.contributor.authorFlores Carrasco, Marcos 
Admission datedc.date.accessioned2018-07-12T22:53:18Z
Available datedc.date.available2018-07-12T22:53:18Z
Publication datedc.date.issued2017
Cita de ítemdc.identifier.citationJ. Phys. Chem. C 2017, 121 (34): 18771−18778es_ES
Identifierdc.identifier.other10.1021/acs.jpcc.7b06563
Identifierdc.identifier.urihttps://repositorio.uchile.cl/handle/2250/149828
Abstractdc.description.abstractThe deposition of Cu onto SiO2 has been carried out by electron beam evaporation in order to study the interface formation by X-ray photoelectron spectroscopy and angle resolved X-ray photoelectron spectroscopy. Shifts in the binding energy of Cu 2p(3/2). and Si 2,p bands, as well as in the Cu LMM kinetic energy, have been observed during the growth. These changes are indicative of a modification in the coordination number of Cu or the formation of M-O-M' cross-linking bonds at the interface. Moreover, different coordination states of Cu+ and Cu2+ (tetrahedral and octahedral) have been detected. Apart from different coordination numbers, a new chemical state appears during the Cu/SiO2 interface formation. This new contribution, Cux+, is attributed to the formation of a mixed oxide Cu-Q-Si. Additionally, two different stages of growth of the Cu/SiO2 interface have been observed: The first one, where no metallic Cu is detected and a mixture of copper oxides is measured onto the SiO2 substrate, and the second one, in which metallic Cu appears on the surface and a multilayer Cu-0/Cux+/Cu oxides/SiO2 can be inferred.es_ES
Patrocinadordc.description.sponsorshipFondo Nacional de Desarrollo Cientifico FONDECYT 3150101 1140759es_ES
Lenguagedc.language.isoenes_ES
Publisherdc.publisherAmerican Chemical Societyes_ES
Type of licensedc.rightsAttribution-NonCommercial-NoDerivs 3.0 Chile*
Link to Licensedc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/cl/*
Sourcedc.sourceJournal of Physical Chemistry Ces_ES
Títulodc.titleEvidence of mixed oxide formation on the Cu/SiO 2 interfacees_ES
Document typedc.typeArtículo de revista
Catalogueruchile.catalogadortjnes_ES
Indexationuchile.indexArtículo de publicación ISIes_ES
Indexationuchile.indexArtículo de publicación SCOPUS


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Attribution-NonCommercial-NoDerivs 3.0 Chile
Except where otherwise noted, this item's license is described as Attribution-NonCommercial-NoDerivs 3.0 Chile