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Authordc.contributor.authorMunizaga, Vicente 
Authordc.contributor.authorGarcía, Griselda es_CL
Authordc.contributor.authorBringa, Eduardo es_CL
Authordc.contributor.authorWeissmann, Mariana es_CL
Authordc.contributor.authorRamírez, Ricardo es_CL
Authordc.contributor.authorKiwi Tichauer, Miguel es_CL
Admission datedc.date.accessioned2014-12-14T19:03:19Z
Available datedc.date.available2014-12-14T19:03:19Z
Publication datedc.date.issued2014
Cita de ítemdc.identifier.citationComputational Materials Science 92 (2014) 457–463en_US
Identifierdc.identifier.otherDOI: 10.1016/j.commatsci.2014.06.006
Identifierdc.identifier.urihttps://repositorio.uchile.cl/handle/2250/119813
General notedc.descriptionArtículo de publicación ISIen_US
Abstractdc.description.abstractThe melting and soldering processes of two iron filled carbon nanotubes is explored by means of classical molecular dynamics, in order to develop an understanding of the underlying mechanisms that govern the dynamics of nano-soldering. Molten Fe flows from the open end of the two CNTs, leading to a liquid junction, and eventually to a solid contact. This soldering process is accompanied by partial or total healing of the carbon nanotubes, which after cooling and relaxation form just a single unit which encapsulates the iron, depending on the relative separation, diameters and axial offset of the nanotubes. This makes for a promising scenario for CNT soldering, repairing and healing, and a variety of different tools in the field of nanoelectronics.en_US
Patrocinadordc.description.sponsorshipThis work was supported by the Fondo Nacional de Investigaciones Científicas y Tecnológicas (FONDECYT, Chile) under grants #1080239 and 1110630 (GG and RR), #1120399 and #1130272 (MK), and Financiamiento Basal para Centros Científicos y Tecnológicos de Excelencia (GG, MK and RR). E.M.B. thanks funding through grant PICT2009-0092 from the Agencia Nacional de Investigaciones Científicas, Argentina, and from the SeCTyP, U.N. Cuyoen_US
Lenguagedc.language.isoenen_US
Publisherdc.publisherElsevieren_US
Type of licensedc.rightsAttribution-NonCommercial-NoDerivs 3.0 Chile*
Link to Licensedc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/cl/*
Keywordsdc.subjectIron filled carbon nanotubesen_US
Títulodc.titleAtomistic simulation of soldering iron filled carbon nanotubesen_US
Document typedc.typeArtículo de revista


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Except where otherwise noted, this item's license is described as Attribution-NonCommercial-NoDerivs 3.0 Chile