Atomistic simulation of soldering iron filled carbon nanotubes
Author
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Munizaga, Vicente
Author
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García, Griselda
es_CL
Author
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Bringa, Eduardo
es_CL
Author
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Weissmann, Mariana
es_CL
Author
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Ramírez, Ricardo
es_CL
Author
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Kiwi Tichauer, Miguel
es_CL
Admission date
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2014-12-14T19:03:19Z
Available date
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2014-12-14T19:03:19Z
Publication date
dc.date.issued
2014
Cita de ítem
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Computational Materials Science 92 (2014) 457–463
en_US
Identifier
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DOI: 10.1016/j.commatsci.2014.06.006
Identifier
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https://repositorio.uchile.cl/handle/2250/119813
General note
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Artículo de publicación ISI
en_US
Abstract
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The melting and soldering processes of two iron filled carbon nanotubes is explored by means of classical
molecular dynamics, in order to develop an understanding of the underlying mechanisms that govern the
dynamics of nano-soldering. Molten Fe flows from the open end of the two CNTs, leading to a liquid junction,
and eventually to a solid contact. This soldering process is accompanied by partial or total healing of
the carbon nanotubes, which after cooling and relaxation form just a single unit which encapsulates the
iron, depending on the relative separation, diameters and axial offset of the nanotubes. This makes for a
promising scenario for CNT soldering, repairing and healing, and a variety of different tools in the field of
nanoelectronics.
en_US
Patrocinador
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This work was supported by the Fondo Nacional de Investigaciones
Científicas y Tecnológicas (FONDECYT, Chile) under grants
#1080239 and 1110630 (GG and RR), #1120399 and #1130272
(MK), and Financiamiento Basal para Centros Científicos y Tecnológicos
de Excelencia (GG, MK and RR). E.M.B. thanks funding
through grant PICT2009-0092 from the Agencia Nacional de Investigaciones
Científicas, Argentina, and from the SeCTyP, U.N. Cuyo