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Effect of self-curing activators and curing protocols on adhesive properties of universal adhesives bonded to dual-cured composites

Authordc.contributor.authorGutiérrez, Mario Felipe 
Authordc.contributor.authorSutil, Elisama 
Authordc.contributor.authorMalaquias, Pâmela 
Authordc.contributor.authorde Paris Matos, Thalita 
Authordc.contributor.authorde Souza, Lucas Marques 
Authordc.contributor.authorReis, Alessandra 
Authordc.contributor.authorPerdigão, Jorge 
Authordc.contributor.authorLoguercio, Alessandro D. 
Cita de ítemdc.identifier.citationDental Materials, Volumen 33, Issue 7, 2018, Pages 775-787
Abstractdc.description.abstract© 2017 The Academy of Dental MaterialsObjectives To measure microshear bond strength (μSBS) and nanoleakage (NL) of self-etch universal adhesives under core buildup restorations using different curing protocols, at 24 h and after 6-month water storage. Methods Middle dentin of 55 molars was divided into: Clearfil Universal Bond [CFU], Prime&Bond Elect [PBE], and One Coat 7 Universal [OCU]. All-Bond Universal [ABU] and Clearfil SE Bond [CSE] were used as control. CFU, PBE and OCU were: light-cured [LC], dual-cured [DC] and self-cured [SC]. Data were analyzed separately (two-way ANOVA), Tukey's test (α = 0.05). Results μSBS: At 24 h OCU/LC resulted in statistically higher μSBS than ABU. CSE/DC showed statistically higher μSBS than all DC adhesives. PBE/LC resulted in significant lower μSBS than the respective DC/SC modes (p < 0.001). At 6-month, both CFU and PBE (LC/SC), resulted in a significant decrease in μSBS. μSBS for OCU/DC decreased significantly (p < 0.001) compared to the respec
Publisherdc.publisherElsevier Inc.
Type of licensedc.rightsAttribution-NonCommercial-NoDerivs 3.0 Chile
Link to Licensedc.rights.uri
Sourcedc.sourceDental Materials
Keywordsdc.subjectBuildup composites
Keywordsdc.subjectMicroshear bond strength
Keywordsdc.subjectSelf-cured activator
Keywordsdc.subjectUniversal adhesives
Títulodc.titleEffect of self-curing activators and curing protocols on adhesive properties of universal adhesives bonded to dual-cured composites
Document typedc.typeArtículo de revista
Indexationuchile.indexArtículo de publicación SCOPUS

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Attribution-NonCommercial-NoDerivs 3.0 Chile
Except where otherwise noted, this item's license is described as Attribution-NonCommercial-NoDerivs 3.0 Chile