The sonic application of universal adhesives in self-etch mode improves their performance on enamel
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The objective of this study was to evaluate the effect of sonic application of universal adhesives on the enamel microshear bond strengths (SBS), in situ degree of conversion (DC) and etching pattern. Ninety-six extracted third molars were sectioned in four parts (buccal, lingual, proximal) and divided into 12 groups, according to the combination of 1) adhesive system (All-Bond Universal [ABU], G-Bond Plus [GBP], Prime&Bond Elect (PBE), and Scotchbond Universal Adhesive [SBU]), and 2) adhesive application mode (manual active etch-and-rinse [M-ER], manual active self-etch [M-SE], and sonic vibration self-etch [S-SE]). Specimens were stored in water at 37 degrees C during 24 h and tested at 1.0 mm/min (mu SBS). DC was evaluated in the enamel-resin interfaces using micro Raman spectroscopy. The enamel-etching pattern was evaluated under a field-emission scanning electron microscope. Data were analyzed with two-way ANOVA and Tukey's test (alpha = 0.05). S-SE application increased mu SBS and DC for all universal adhesives when compared to M-SE (p < 0.05). S-SE application resulted in mean bond strengths that were statistically similar to those obtained with the respective ER application mode (p > 0.05). A deeper enamel-etching pattern was observed for all universal adhesives in the etch-and-rinse strategy. An improvement in etching ability was observed in S-SE application compared to M-SE application. In light of the improved performance of universal adhesives when applied sonically in SE mode, selective enamel etching with phosphoric acid may not be crucial for their adhesion to enamel. The sonic application of universal adhesives in self-etch mode may be a practical alternative to enamel etching.
Artículo de publicación SCOPUS